Background & Context
This project was developed as part of the Advanced Information System Analysis and Design course, where the goal was to design a comprehensive information system prototype using structured system modeling techniques.
The case study, Artevo, focuses on a conceptual digital art marketplace that connects artists and art enthusiasts through a mobile application. While the system was not implemented, it served as the foundation for applying real-world system design concepts, covering requirements analysis, process modeling, architecture planning, and database design.
Project Objective
The objective of this project is to analyze, model, and design Artevo’s end-to-end system architecture using object-oriented methodologies, ensuring scalability, security, and user-friendly experiences across Android and iOS platforms.
Project Scope & Deliverables
1. Requirements and Process Modeling
Created Activity Diagrams and Use Case Diagrams to map user interactions such as registration, ordering, cancellation, and forum posting.
Developed Use Case Fully Descriptions for eight main functions: user registration, order creation, order cancellation, cancellation verification, artwork upload, forum upload, reply forum, and report generation.
2. System Architecture
Designed a Three-Tier Architecture separating the presentation layer (mobile UI), application layer (business logic), and database layer (MySQL server) for scalability and security.
3. Input & Output Design
Defined detailed system inputs and outputs for forms, transactions, and reports (e.g., order forms, cancellation reports, statistical summaries).
4. Database & Class Design
Built a Data Record.
Created First-Cut Class Diagrams, CRC Cards, and Updated Class Diagrams to illustrate data relationships and object responsibilities.
5. Sequence & Communication Diagrams
Developed System Sequence Diagrams, Three-Layer Sequence Diagrams, and Communication Diagrams to represent the flow of data between actors and system layers.
6. Package Diagram
Organized all system components into modular packages for better maintainability and future scalability.
